Machining of electrically conductive parts (silicon, stainless steel, ceramics...) is performed by micro electrical machining with an ultrafine cylindrical tungsten tool (1-10 μm) of very high aspect ratio (x10 - X100). 3D shapes are obtained by vertical and lateral displacement of the microtool. This one is obtained with a patented low cost and automated innovative process based on the electrochemical dissolution of tungsten. The wear of the tool during micromachining is regularly compensated by electrochemical regeneration. The entire process, protected by 2 patents, targets the manufacturing of 3D microparts and microtools at mesoscopic level with a low cost and fully automated machine. Software interface with CAD systems has been developed.